Electronic Design
Interconnect System Eyes High-Density Apps

Interconnect System Eyes High-Density Apps

Designed for high-density applications, the z-Quad Small Form-factor Pluggable Plus (zQSFP+) interconnect system delivers 25-Gb/s data rates and support next-generation 100-Gb/s Ethernet and 100-Gb/s InfiniBand enhanced data rate (EDR) designs. System components include a surface-mount, through-hole connector. The zQSFP+ SMT EDR application consists of four lanes of differential signals, capable of data rates of 40 Gb/s. Its patent-pending preferential coupling design uses insert molding to support a narrow edge-coupled blanked and formed contact geometry to optimize electrical performance. The connector shares the same mating interface as the QSFP+ form factor, making it backward compatible with current connectors, cages and cable assemblies. MOLEX INC., Lisle, IL. (800) 786-6539.

TAGS: Components
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