Described as the smallest to date, the SD25 series SAW duplexer with integrated matching circuit in a chip scale package (CSP) employs a unique simulation technology that mounts the SAW element directly on a ceramic substrate, seals it, then coats it with resin. Optimizing the combination of the SAW element and the substrate enables the duplexer to be as small as 2.5 mm x 2 mm x 0.8 mm typical. The device boasts of high resistance to climate and mechanical impact due to its airtight structure. Low-temperature, co-fired ceramics are used as the substrate, which allows for the integration of an inductor for a matching circuit. As a result, the SD25 series requires no external inductor. Additionally, the device is RoHS compliant. Specifications include an insertion loss of 2.3 dB, attenuation of 35 dB from 869 MHz to 875 MHz, and an isolation of 55 dB. KYOCERA CORP., San Diego, CA. (858) 882-2000.
Company: KYOCERA CORP.
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