The Model 3005 lead-attach machine attaches SIP leadframes to substrates and is claimed to be a lower-cost, higher-efficiency alternative to hand tooling. The leadframe is indexed into position and a pressure pad assembly provides the proper pin removal. With the lead frame in position, the operator loads the substrate into the insertion area and then the machine inserts the substrate into the lead frame. Discrete devices are then singulated, thereby completing the process. The machine comes complete with a handload inserter, pressure pad, lead feed, pin removal punch, and carrier cut-off punch. The basic tooling will accommodate a wide range of substrate sizes ranging from 0.25'' to 4'' long, and 0.15'' to 3'' in depth. A PLC is provided to control all timing and sequencing. Typical throughput is approximately 800 to 1,200 packages per hour. A standard model is priced at $10,000; and rental and lease options are also available.
Company: DIE-TECH INC.
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