Metal Matrix Composite Claims High Reliability

Described as a highly reliable and low cost solution for electronic thermal management and packaging, the company?s aluminum-silicon-carbide (AlSiC) metal matrix composite promises a tailored coefficient of thermal expansion (CTE), compatible with various electronic devices and assemblies. The isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. Its CTE matching capabilities eliminate the need for thermal interface stacking. Other reported features include a unique casting process that allows the integration of very high thermal conductivity inserts, in excess of 1,000 W/mK, or cooling tubes for more advanced thermal management solutions. CPS CORP., Chartley, MA. (508) 222-0614.