A new metal matrix composite that's made from aluminum silicon carbide (AlSiC) delivers high-reliability and low-cost lids, or heat speaders, to flip-chip IC packaging. AlSiC can support a tailored coefficient of thermal expansion (CTE) for compatibility with various electronic devices and assemblies. Unlike traditional packaging materials, the isotropic CTE value of AlSiC can be adjusted for specific applications by modifyng the Al-metal/SiC-particulate ratio. The composite also exhibits a high thermal conductivity that results in efficient thermal dissipation and prevents the bowing and flexing of packaging and substrate material that can lead to failure. Call the company for pricing information.