Packaging pact

Leuven, Belgium:
ICOS Vision Systems, a supplier of inspection solutions for the semiconductor industry, and IMEC, the nanoelectronics and nanotechnology research centre, have agreed to a two-year joint exploration and development program in the field of inspection and metrology for three-dimensional (3D) packaging. Analysts predict the 3D packaging market to grow rapidly over the next few years.

TAGS: Components
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