Designed to adhere only to the heat spreading device, while separating cleanly and easily from the chip or component when rework is needed, T-mate consists of one non-stick surface of malleable metal alloy, combined with high performance phase change material. This design is said to yield low thermal resistance. The material can be applied at room temperature and requires no pre-heating of the heat-spreading device. When heated to 70°C, and under pressures as low as 5 psi, it flows to fill any surface irregularities, without exhibiting excessive flow characteristics. The material is suited for applications in notebook computers and semiconductor test heads.
Company: THERMAGON INC.
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