Electronic Design
Socket And Header Offerings Expand

Socket And Header Offerings Expand

The company now offers a choice between 0.05” and 0.1” grid horizontal Z-Bend sockets and receptacles. For low profile I/O applications, the surface-mount SIP socket and header strips are assembled parallel to their board surface. The 310, 0.1” grid, horizontal surface-mount Z-Bend sockets employ MM #1023 receptacles that accept pin diameters from 0.015” to 0.025”. These sockets are rated 3A per position. Series 801, 0.1” grid components use MM #1303 receptacles that accept pin diameters from 0.025” to 0.037” and 0.025” square leads. These sockets are rated at 4.5A per pin position. Standard configurations are available from two to10 positions with a 0.005” co-planarity rating. The Series 850, 0.050” grid horizontal SMT Z-Bend Headers are available with 0.016” diameter solder tails and pluggable pins using MM #4006-1 receptacles. Series 851 horizontal SMT Z-Bend sockets use MM #4890-1 receptacles that accept pin diameters from 0.015” to 0.02”. These headers are rated at 3A per pin position. Standard configurations are two to 20 positions with a 0.005” coplanarity rating. MILL-MAX MANUFACTURING CORP., Oyster Bay, NY. (516) 922-6000.

 

TAGS: Components
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