The company's micro BGA and CSP test and burn-in sockets can accept devices measuring up to 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both components employ solderless, pressure-mount compression spring probes found by two molded plastic alignment pins and held with four stainless steel screws. Capable of surviving up to 500,000 cycles, the spring probe contacts inflict 9g to 12g of pressure per contact for 0.5 mm to 0.75 mm pitches and 17g to 20g per contact for 0.8 mm pitches and greater. Operating temperature ranges from -55°C to 150°C. Additionally, the sockets are available in custom materials, plating, sizes, and configurations. Single-unit price for a 100-lead socket is $175 with a delivery time of two weeks ARO. For more information, contact Frank Folmsbee at ARIES ELECTRONIC INC., Frenchtown, NJ. (908) 996-6841.
Company: ARIES ELECTRONIC INC.
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