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Solder-Free Adhesive Suits BGA Rework

Claiming to be ideal for BGA rework and repair, these electrically-conductive, solder-free adhesives are supplied as a dry film on a Mylar carrier and are Z-axis conductive. The adhesives are solvent free, which makes them a viable solution for green regulations that require lead-free manufacturing.
Another advantage claimed for these adhesives is that they demonstrate three times the durability of traditional solder-attached components. The film adhesives are also said to eliminate many of the concerns associated with solder and paste applications, such as ease of use and environmental concerns.

Company: APS TECHFILM

Product URL: Click here for more information

TAGS: Components
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