The use of an improved material formulation allows the new HeatPath GTQ 1502 thermal interface gel to meet the tough UL94 VO flammability standards for electronic equipment. The gel is designed for thermal management of sensitive components, microprocessors and power devices in consumer electronics, telecommunications equipment, and more.The gel is an alumina-filled silicone material that serves as an interface between the sensitive electronic components and their heatsink or chassis, eliminating air gaps for lower thermal impedance and device junction temperature.
Company: RAYCHEM CORP. - Electronics OEM Components Division
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