EE Product News

Thermal Interface Material Is For Power Applications

Designed to provide minimal thermal resistance between the baseplate of a dc-to-dc converter and its associated heatsink under moderate-to-high interface contact pressure of 50 to 300 psi, Thermflow T310 material can be consistently applied as a dry pad at room temperature, yet conforms to surface irregularities at operating temperatures, in an action similar to thermal grease. With its ability to fill air gaps and voids created by surface imperfections, these pads are said to out-perform elastomeric or graphite-based thermal pads. Material comes in rolls of 100 feet by 0.75 to 20 inches. It can also be pre-cut for specific power module shapes and supplied as kiss-cut pads on a roll.

TAGS: Components
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