Underfill Technology Eliminates Fluxing For Flip-Chip Devices

Sept. 1, 1998
Combining solder flux and underfill in a single material, AMICON E 1330 series of no-flow-fluxing encapsulants enables the rework of flip chip assemblies by not curing through the reflow cycle. This allows the flip chips to be tested and removed prior

Combining solder flux and underfill in a single material, AMICON E 1330 series of no-flow-fluxing encapsulants enables the rework of flip chip assemblies by not curing through the reflow cycle. This allows the flip chips to be tested and removed prior to curing the underfill, leaving the substrate "same as original" and ready to accept another flip chip. A post cure is then required. Use of flow-fluxing encapsulants eliminates tedious and expensive fluxing, flux cleaning and underfill capillary flow to make the process SMT compatible. By contrast, AMICON E 1350 does cure during a modified reflow cycle and no post cycle is required.

Company: EMERSON & CUMING SPECIALTY POLYMERS

Product URL: Click here for more information

Sponsored Recommendations

Board-Mount DC/DC Converters in Medical Applications

March 27, 2024
AC/DC or board-mount DC/DC converters provide power for medical devices. This article explains why isolation might be needed and which safety standards apply.

Use Rugged Multiband Antennas to Solve the Mobile Connectivity Challenge

March 27, 2024
Selecting and using antennas for mobile applications requires attention to electrical, mechanical, and environmental characteristics: TE modules can help.

Out-of-the-box Cellular and Wi-Fi connectivity with AWS IoT ExpressLink

March 27, 2024
This demo shows how to enroll LTE-M and Wi-Fi evaluation boards with AWS IoT Core, set up a Connected Health Solution as well as AWS AT commands and AWS IoT ExpressLink security...

How to Quickly Leverage Bluetooth AoA and AoD for Indoor Logistics Tracking

March 27, 2024
Real-time asset tracking is an important aspect of Industry 4.0. Various technologies are available for deploying Real-Time Location.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!