Groomed for portable products, the Universal Contact, a small form factor, stamped contact, is suitable for solderless component interconnections requiring miniaturization, reliability, and flexibility. It employs a unique pre-loading and anti-lift design to maximize contact force and ensure consistent and reliable contact integrity. The contact’s X-Y-Z movement ability promises a robust connection between the contact and component assembly and specifies a life cycle of 3,000 operations. Compliant with WEEE and RoHS directives, the component is available in heights ranging from 1.3 mm to 4 mm. Compressed heights as low as 0.9 mm are also available. Other features include side wings to protect the active parts of the contact and prevent overstressing. For more details, contact Nas Hashemian at ITT INTERCONNECT SOLUTIONS, Santa Ana, CA. (714) 628-8370.
Company: ITT INTERCONNECT SOLUTIONS
Product URL: Click here for more information