EE Product News

Solid-State Relays Boast Thermal Stability

Opposed to a traditional metal-base plate, the Hockey Puck series solid-state relays incorporate a ceramic substrate for direct contact with the heat sink, significantly reducing thermal resistance between the power semiconductor in the SSR and the internal heatsink. The relays combine fused-copper power semiconductors with ceramic surface-mount technology in the control and opto-isolation stages of the SSR.Mounting of the power semiconductor involves applying the lead frame containing the power devices directly to the substrate.

Company: TELEDYNE RELAYS

Product URL: Click here for more information

TAGS: Components
Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish