Ultra-Small SMT LEDs Address Solderability Issues

July 1, 1999
By optimizing plating thickness and the type of plating used, the Toshiba 1100 and 1102 Series of surface-mount LEDs are said to represent an advance in ease of solderability. The high-intensity, ultra-small LEDs feature Toshiba’s InGaAlP

By optimizing plating thickness and the type of plating used, the Toshiba 1100 and 1102 Series of surface-mount LEDs are said to represent an advance in ease of solderability. The high-intensity, ultra-small LEDs feature Toshiba’s InGaAlP technology and incorporate a built-in reflector for increased brightness and uniformity. Available colors include: pure green, green, yellow, orange, red-orange, and red. Although the LEDs are best suited to backlighting applications where space is at a premium, they also lend themselves to light-pipe and indicator applications. The 1100 Series LEDs have a 3-mm diameter flat top and the 1102 Series a 2.8-mm diameter lens top.

Company: MARKTECH OPTOELECTRONICS

Product URL: Click here for more information

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