Promising twice the density of currently available flash components to mobile and consumer electronics makers, the company's NAND flash device squeezes 8 Gb of memory into a standard TSOP 1 (QDP) package. The device comes by way of proprietary manufacturing capabilities and is produced on 12" wafers in a 90-nm process. Target applications include emerging mobile phones and converged handheld devices that integrate multimedia features, such as imaging, digital music, and video. For further information and pricing, contact SAMSUNG ELECTRONICS CO. LTD., San Jose, CA. (408) 544-4000.
Company: SAMSUNG ELECTRONICS CO. LTD.
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