The development of I/O-intensive telecomm systems is sped up with the introduction of the MSX532, a crossbar-based matrix device. Representing the first member of a new series of SRAM-based in-system programmable, switching matrix devices, the chip allows OEMs to develop scalable system designs that can be easily modified to meet growing customer needs for increased I/O density, as well as complying with evolving industry standards. The crosspoint switch operates off of a 3.3V power supply and features low-voltage TTL I/Os. The telecomm device comes packaged in a 792-pin TBGA. Samples of the device are available.
Company: I-CUBE INC.
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