Design FAQ: 3D NAND Flash Memory

Sponsored by Toshiba

What is 3D NAND? What is the difference between bonded and through-silicon via (TSV) approaches? What is different about the controller used for 3D NAND flash versus floating gate (FG)? What mechanical issues face the industry moving from floating gate to 3D NAND flash? So what is next with 3D NAND?

Get the answers to these questions and more. Download "3D NAND Flash Memory" from Toshiba today.

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TAGS: Design FAQs