EE Product News

Flash Components Enable Seamless Migration To High Densities

Packaging compatibility with the firm's current offering of single-level cell 256-Mbit and 512-Mbit devices allow the new 0.25-µm 128-Mbit NAND flash components to provide seamless migration to higher density devices. In order to provide forward compatibility with these devices, the TC58128FT chip (pictured) is encased in TSOP Type I packaging. The firm is also offering the TC58128DC, which features SmartMedia packaging and provides 16 Mbytes of removable storage. Identical page and block specs are used, making the devices fully compatible with existing products.
Both devices operate at a 3.3V single power supply. Applications include flash memory cards, solid-state disk drives, digital cameras, and set-top boxes. Pricing is $28 each for TC58128FT and $31 each for TC58128DC.

Company: TOSHIBA AMERICA ELECTRONIC COMPONENTS INC. (TAEC)

Product URL: Click here for more information

TAGS: Digital ICs
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