Claimed to be the industryÕs smallest and thinnest memory modules, the members of this micro-DIMM product line measure only 1.18" high and have a capacity of 256 MB for both SDR- and DDR-based systems. The modules target designers of mobile, embedded and other applications with a critical need for high-capacity memory.The modules employ the companyÕs advanced flip-chip chip scale package (FCCSP), which has about a 45% smaller footprint than standard TSOP packages. The FCCSP uses a JEDEC-compliant FBGA (fine-pitch BGA) 60-ball layout for I/O pins. In addition to its small footprint, FCCSP is also said to have performance advantages over other types of BGA packages that traditionally use wire-bonding to connect the IC to the underlying substrate. By eliminating the wire-bonds with direct die attach, FCCSP is able to reduce inductance, therefore increasing noise margins and allowing for higher frequency system operation. ATP ELECTRONICS, San Jose, CA. (408) 732-5000.
Company: ATP ELECTRONICS
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