Using a patented IC Tower stacking technology, in which multiple memory chips are stacked together to increase the capacity of the memory module without increasing the product footprint, the PC133-SDRAM dual-inline memory modules (DIMMs) measure just 1.05" high. Designed specifically for the latest generation of thin, rack-mountable servers, the modules are available in registered configurations of 128, 256 and 512 MB and 1 GB in168-pin registered DIMM x 72 ECC packaging. Other features include burst mode operation, auto and self refresh capability, LVTTL compatible inputs and outputs, and 3.3V ± 0.3V operation.
Company: SIMPLE TECHNOLOGY
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