EE Product News

SRAM Modules Taps Into CSP Technology

These chip-scale package (CSP)-based memory modules are said to have the density of die-based modules but without the yield and manufacturing problems associated with memory die-based products. The PUMA68S16000XB is a 512K x 32 SRAM that is user-configurable as 8, 16 or 32 bits wide in a JEDEC standard 68 J-lead package.

Company: MOSAIC SEMICONDUCTOR INC.

Product URL: Click here for more information

TAGS: Digital ICs
Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish