EE Product News

SRAMs Put 4 MB In High-Density Package

Used as a controller module for race cars, these 4-MB SRAMs are available as 3.3V or 5V devices in 84-pin 1.070-in. sq. G3 ceramic quad flatpacks. The 1M x 32 SRAM packs 3.74 MB per sq. in. compared with the 2.33 MB of the 512K x 32 SRAM CQFP. The G3 fills the same fit and function as the JEDEC 84-pin CQFJ or 84-pin PLCC, yet has the TCE and lead inspection advantage of the CQFP format. The WS1M32V-XG3X is 3.3V and the WS1M32-XG3X is 5V. The module is organized as two banks of 512K x 32 and is user configurable as 2M x 16 or 4M x 8. Access times are 17, 20 or 25 ns.

Company: WHITE ELECTRONIC DESIGNS CORP.

Product URL: Click here for more information

TAGS: Digital ICs
Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish