An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing component packaging size compared to TSOP packages, the CS-Stack package interface consists of tiny solder balls on the bottom of the chip.Standard memory components and new memory types can be packaged using CS-Stack stacking techniques. Samples of CS-Stack packages are available now and production will begin in 2002. DPAC TECHNOLOGIES CORP., Garden Grove, CA. (714) 898-0007.
Company: DPAC TECHNOLOGIES CORP.
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