Audio Chip Packs Codec And Power Management

Oct. 8, 2008
Expanding the AudioPlus Smart Power product line, the WM8400 audio IC combines a multimedia Codec with power management features to provide audio and mixing capabilities, longer battery life, and reduced system costs for multimedia mobile handset

Expanding the AudioPlus Smart Power product line, the WM8400 audio IC combines a multimedia Codec with power management features to provide audio and mixing capabilities, longer battery life, and reduced system costs for multimedia mobile handset makers. In addition to the multimedia CODEC, the chip integrates FLL, two dc/dc converters, and four LDO regulators into a compact BGA package. Hardware control allows the device to support generic power management requirements. Other features include a SNR of 98 dB, software-selectable Class AB or Class D speaker driver operation, a 1W mono speaker driver, low leakage, high PSRR, and pop/click suppression. The WM8400 is sampling now in a 105-pin, 6 mm x 6 mm BGA package. WOLFSON MICROELECTRONICS PLC, San Diego, CA. (858) 676-5090.

Company: WOLFSON MICROELECTRONICS PLC

Product URL: Click here for more information

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