A family of power amplifiers for point-to-point radio systems covers the allocated bands from 2.5 to 19.7 GHz. The MAAPGM00XX-DIE line, from M/A-COM, comprises 10 versions covering various frequency ranges with gains up to 34 dB with ±1-dB flatness. The amplifiers meet the typical requirements for point-to-point radios with third-order intercept points from 38 to 44 dBm. Output levels range from 1 to 2 W. Each amplifier's drain supply can be set within 6 to 10 V to optimize system performance, including linearity, gain, and power efficiency.
All die are fabricated using M/A-COM's MSAG (Multi-function Self-Aligned Gate) process, which features a rugged polyimide coating and no air bridges. This coating produces a rugged chip for high assembly yields. The mean time to failure is one million hours at a 170°C junction temperature. Each amplifier is available in bare die and plastic packaged options. The package is a 20-lead, 5-mm PQFN, which is suitable for standard surface-mount assembly processes. The amplifiers are RoHS compliant and compatible with a 260°C reflow temperature. Leaded versions are available upon request for military applications.
The MAAPGM00XX-DIE amplifiers are usually available from stock in small quantities. Production lead times start at 12 weeks for bare die and 16 weeks for plastic-packaged versions. Bare die cost from $27 to $32 in 1000-piece lots, and packaged versions cost $24 to $29 in 1000-piece lots.
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