Chips Step Closer To Integrating MEMS Sensors With MCUs

Chips Step Closer To Integrating MEMS Sensors With MCUs

Barcelona, Spain: Baolabs is now producing its NanoEMS CMOS microelectromechanical systems (MEMS) devices in volume on a standard CMOS production line, bringing the company’s vision of easy and cost-effective integration of MEMS sensors with microcontrollers on the same chip, on the same CMOS production line, a step closer.

The first device to be produced, Baolab’s three-axis NanoCompass CMOS MEMS compass, uses the company’s NanoEMS technology to create nanoscale MEMS within the standard metal structure of a high-volume manufactured CMOS wafer.

Baolab envisages NanoEMS structures that can be easily incorporated into ASICs for applications such as RF antennas, RF switches, near-field communications (NFC), and automotive. Evaluation kits for the company’s 3D NanoCompass will be available at the end of February.

Baolab Microsystems
www.baolab.com

TAGS: Automotive
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