TDK is touting their new series of multi-channel power management modules as the world’s first IC embedded power management module for smartphones and tablets. Aimed at reducing lead times and development costs for manufacturers, the new product, based on the company’s SESUB technology, features a power supply management IC chip that is embedded directly into the substrate. Combined with newly developed SMT capacitors and power inductors, the result is advanced multi-channel power management capabilities in a single miniature (11 x 11 x 1.6 mm) package. The major features of the new power management module are its high-efficiency step-down converter power supply in a 5-channel configuration with a maximum output of 2.6 A, and its low-noise, low-loss voltage regulator power supply for up to 23 channels. Due to the IC being completely embedded in the miniature three-dimensional SESUB structure, the power management module features superior thermal attributes compared with discrete packaged ICs. The module also improves EMC performance due to the self-shielding effect of its design.
Embedded Power Management Modules Boost Smartphones/Tablets
New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.