EE Product News

New SMT Package Slashes Real-Estate Requirements For Power Semis

Reported to be 40% smaller than the firm's TO-220SM package and 62% thinner than the size of a TO-220 package, the Thin Flat Package (TFP) for power semiconductors was developed with flat leads along the rear side and a special heatsink design that allows for 20% lower thermal dissipation when compared to a D2-PAK. These features suit the TFP package for use where space is at a premium and where reducing heat dissipation is a key design criteria, such as dc/dc converters, power supplies for cell phones, and other high-current, high-speed switching products.

Company: TOSHIBA AMERICA ELECTRONIC COMPONENTS INC. (TAEC)

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