Sporting a “hole-less” T0-220 outline with an electrically isolated mounting tab, the new ISOPLUS220 plastic encapsulated package features 2,500V of isolation voltage and high power dissipation. Power cycling is also said to be better than that for TO-220-packaged parts.
In the new package, standard copper lead frames have been replaced by Direct-Copper-Bonded alumina to which any discrete semiconductors, from diodes to thyristors to IGBTs and MOSFETs, can be soldered. By eliminating screw holes, ISOPLUS220 packages make room for larger power semi dice, which can control higher currents. And the package can be mounted directly onto heatsinks without using isolation interface material.
Company: IXYS CORP.
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