Thanks to use of a punch-through trench chip for 600V devices and a thin-wafer, non-punch-through chip for 1200V devices, a new family of compact intelligent power modules offer 20% lower overall losses through a reduction in saturation voltage. Designed for general-purpose inverter applications, the Compact IPM family provides designers with a 40% reduction in package size compared with the firm's previous IPM family.The Compact IPM family features four package sizes containing multiple switches, depending on the ratings, for the entire 600V and 1200V lineup. All include drive and protection circuitry. Current ratings range from 50A to 600A for 600V units and 50A to 400A for 1200V units.
Company: TOSHIBA AMERICA ELECTRONIC COMPONENTS INC. (TAEC)
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