EE Product News

Carrier Trays Protect Components

Providing high levels of protection in the handling and shipping of sensitive electronic components, WafflePack chip trays are well-suited for carrying devices such as bare and bumped die, CSPs, fine pitch BGAs and other precision components. Available in 2" x 2" and 4" x 4" standard tray sizes, WafflePack trays are made from a high-grade polycarbonate polymer and offer a 125°C bake temperature tolerance and excellent ESD properties. The trays are also said to offer superior dimensional stability and structural rigidity.

Company: ITW ELECTRONIC COMPONENT PACKAGING SYSTEMS

Product URL: Click here for more information

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish