Electronic Design UPDATE: October 27, 2004

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Electronic Design UPDATE e-Newsletter
Electronic Design Magazine 
PlanetEE ==> www.planetee.com
October 27, 2004
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Today's Table Of Contents:
1. Editor's View
  * Early-Bird Predictions For Comm Technology In 2005
2. Focus On FPGAs
  * Generic Framing Procedure Mapper Runs On FPGAs
3. News From The Editors
  * New T&M Standards Group Gains A Member
  * Aluminum Electrolytics Target Auto Use
  * OLED Market Up, Though Not As Much As Thought 
4. Upcoming Industry Events
  * Next Generation Networks
  * Embedded Systems Conference
  * Electronica, including The World of MEMS at Electronica
  * Wireless Congress 2004: Systems & Applications
5. Magazine Highlights: October 18, 2004
  * Cover Story: Engineering Feature -- The Ballot Is Open On Electronic 
    Voting
  * Technology Report -- Evolving PoE Promises Rich Landscape Of Power 
    Innovation
  * Technology Report -- Architectural Advances Propel FPGAs Into 
    High-End ASIC Turf
  * Leapfrog: Industry First -- 32-Bit Architecture Challenges 8-Bit 
    Processors
  * Leapfrog: Industry First -- Power Supply Eyes Next Generation Of 
    Blades
  * Design View/Design Solution -- Design Great Interconnects By 
    Treating FPGAs Like Software

Electronic Design UPDATE edited by John Novellino, Senior Technology 
Editor

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THOUGHT YOU'D MISSED THEM? DON'T WORRY, THEY'RE ARCHIVED
Electronic Design's two latest webcasts are available online:
 
COM Express -- Emerging Standard: Bill Wong examines COM Express, the 
new Computer-on-Module standard from the PCI Industrial Computer 
Manufacturers Group. Wong looks at what's inside the standard, its 
effect on high-speed serial technologies, and how it's changing the 
embedded landscape.

http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMBG0Ao

Selecting the Best ASIC Solution: Dave Bursky discusses the ASIC 
selection process, exploring the decision points you should consider in 
determining the right ASIC design route. Bursky and a panel representing 
leading ASIC manufacturers explore the issues you face when planning a 
new chip design.

http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVH0AB

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Join Electronic Design and LeCroy for a free, one-hour webcast 
discussing Advances in Signal Integrity Testing, starting at 2:00 p.m. 
EST on Thursday, November 11. Topics covered will include methods 
engineers can use to test the effect of probe loading on signal shape, 
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1. Editor's View -- Exclusive to Electronic Design UPDATE
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Early-Bird Predictions For Comm Technology In 2005

By Louis E. Frenzel, Communications/Networking Editor

I do not write for ED UPDATE very often, so I thought I would take this 
opportunity to share with you my crystal-ball predictions for the coming 
year -- just some thoughts on what's in store for you as far as wireless 
and networking technologies are concerned. See the future here and now. 
   -- Broadband over power line (BPL): Neat idea, but my gut tells me 
that this is a loser. It's being tested and it does work, but the 
speeds are low (less than 500 kbits/s) and the side effects aren't 
pretty. Even though the FCC and NTIA gave their full blessing 
recently, look for this technology to die quietly. There's too much 
competition from the forthcoming superior broadband wireless services 
and passive optical networks (PONs).
   -- Cell phones: Expect a continued rollout of the 2.5G quasi-3G 
technologies like EDGE and cdma2000 EV-DO with higher data rates and 
more multimedia options. Higher-res cameras and built-in Wi-Fi will 
show up. But look for only a fraction of the 3G we were all 
expecting.
   -- Mesh networks: Lots of R&D is going on worldwide. There are gobs 
of potential uses for the motes (tiny wireless nodes), but the whole 
technology is not yet ready. We do have some low-cost mesh radios in 
the form of ZigBee chips ready to do this service, but the real 
problem comes in the infrastructure needed to deal with the firestorm 
of data these things will generate. It is a back-office type of 
software nightmare. I do believe mesh will eventually be 
excruciatingly useful, but not next year. Yet ZigBee will be super 
hot and grow in double digits.
   -- Passive optical networks: This is the ultimate fast broadband 
connection that will do almost anything. It is expensive, and the 
carriers have held off on big deployments for that reason. But my 
guess is that they are running scared because of the rush of Voice 
over Internet Protocol on cable and Wi-Fi. In addition, WiMAX, the 
broadband wireless technology, is almost here to do the same thing. I 
bet that some if not all of the major RBOCs will start rolling out 
PONs in selected areas not just to stay competitive, but to survive.
   -- RFID: The tags are still too expensive for cheap and common items, 
but the prices are coming down and the technology is developing so 
that the nickel tag is almost here. Look for continued growth but no 
real big breakthrough.
   -- Wi-Fi: The chips are now more fully integrated and prices keep 
declining. Cell phones are getting Wi-Fi. More and more hot spots are 
showing up everywhere. I'm not sure anyone is making any money, but 
the growth will continue. The super-fast version (100+ Mbits/s) of 
wireless local-area networks dubbed 802.11n by the IEEE will linger 
in development with ratification beyond next year. 
   -- WiMAX: This is the IEEE's 802.16 broadband wireless standard. It 
is ratified, and several companies are making chips and equipment. 
This technology offers lots of promise for wireless consumer 
broadband access, but it remains to be seen how well it does in 
non-line-of-sight environments. Look for chips and equipment next 
year but the real rollout to come in 2006.
   -- Ultra-wideband (UWB): The vote is still split in the IEEE 
802.15.3a standards task group between the direct-sequence (DS) 
CDMA-like technology (Freescale) and the Multiband OFDM Alliance 
(MVOA) model (everyone else). Each will probably go its own way. 
Freescale already has real product and is selling it. Look for it in 
consumer products next year. The MBOA group is still wrestling with 
its designs, although some do have first silicon. I see some chips 
showing up next year and a few end products.
   To wrap up, I might as well go out on a limb and predict the 
presidential election. I believe it will be Bush by a miniscule 
majority but with chad-less recounts in some states. That means we 
will surely get Hillary in 2008. I hope these outcomes will be good 
for the electronics industry.
   Let me be the first to wish you a happy 2005, too!

To comment on this Editor's View, go to Reader Comments at the foot of 
the Web page:  

Electronic Design UPDATE ==> 
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVJ0AD

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2. Focus On FPGAs
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***Generic Framing Procedure Mapper Runs On FPGAs
A programmable generic framing procedure (GFP) mapper is now available 
as a block of intellectual property for Xilinx FPGAs. The mapper block 
complements the legacy Sonet/SDH framers and allows customers to enhance 
the capabilities of their systems. For example, a line card based on the 
Virtex 4 platform can be used to encapsulate and transport Fibre 
Channel, Ethernet, or video data at multiple rates over exisiting 
Sonet/SDH networks. The GFP core fully implements the ITU-T GFP 
recommendation (G.7041/Y.1303). Protocol support includes Ethernet, PPP, 
RPR, GE, Fibre Channel, FICON, ESCON, and DVB-ASI. The core is available 
for the Virtex 4, Virtex II, Virtex II PRO, and Spartan 3 devices. The 
programmable fabric of the FPGA allows the core to be configured for 
frame-mapped, transparent, or mixed-mode operation on a per-channel 
basis, enabling multiline, multiservice cards and systems in 
Ethernet-over-Sonet or Data-over-Sonet applications. The Xilinx CORE 
Generator tool lets designers easily configure the GFP core to support 
specific system requirements, including individually optimized cores for 
OC-48 and OC-192 applications. Available under the terms of the SignOnce 
license agreement, the license cost of the core is $18,000.
     Xilinx ==> http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVK0AE 

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3. News -- From The Editors
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***New T&M Standards Group Gains A Member
Keithley Instruments has joined the LXI (LAN Extensions for 
Instrumentation) Consortium, which will hold its first membership 
meeting Nov. 17-18 in Salt Lake City, Utah. LXI was introduced last 
month by Agilent Technologies and VXI Technology Inc. as a 
next-generation, LAN-based (local-area network) modular platform 
standard for automated test systems. The goal is to combine built-in 
measurement science and PC-standard I/O connectivity from rack-and-stack 
instruments with the modularity and size reduction of card-cage-based 
systems. The LXI Consortium was formed to develop, support, and promote 
the LXI standard. The first meeting will focus on the LXI 
specifications, membership recruitment, and technical discussions, as 
well as the establishment of working groups.
     LXI Consortium ==> http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVL0AF 

***Aluminum Electrolytics Target Auto Use
A series of large aluminum electrolytic capacitors is well suited for 
automotive applications. A special corrugated design allows the devices 
to pass vibration tests at up to 30G and 2 kHz, after being stressed at 
125 deg. C for more than 2000 hr. Units rated to 40G are available on 
request. Capacitance ranges from 1100 to 6800 microF at 25 to 63 V. 
Maximum continuous operating temperature is 150 deg. C. The capacitors 
offer a ripple current capability of 13 A at 10 kHz and 105 deg. C, at 
which their service life is 20,000 hr. The capacitors come with either 
snap-in terminals or terminal wires suitable for welding or soldering. 
Prices vary by type and quantity. Orders can be placed immediately. 
     Epcos Inc. ==> http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVM0AG 

***OLED Market Up, Though Not As Much As Thought
The future looks bright for organic light-emitting diodes (OLEDs), 
although strong competitive pressure from LCDs will keep a lid on unit 
sales and pricing. The good news for OLEDs is that the global market 
will hit 35.3 million units this year, up 110% from 16.8 million units 
in 2003, according to market research firm iSuppli Corp., El Segundo, 
Calif. Revenue will rise 74%, from $246 million in 2003 to $429 million 
this year. Earlier predictions were for 36.2 million units and $470 
million in sales. The major reason for the lower numbers is strong 
pressure from super-twisted nematic (STN) LCDs, which grabbed some 
business from OLEDs as mobile-phone makers sought to reduce materials 
costs. OLED makers responded with price cuts that will recoup sales in 
the fourth quarter, according to iSuppli's report, "Organic 
Light-Emitting Diode Displays--Semi-Annual Report--H2 2004."
     iSuppli Corp. ==  http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BCl80A6 

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4. Upcoming Industry Events
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Nov. 1-5, Next Generation Networks
Boston, Mass.
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVN0AH 

Nov. 8-10, Embedded Systems Conference
Munich, Germany
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh105Tu0AO 

Nov. 9-12, Electronica, including The World of MEMS at Electronica
Munich, Germany
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVO0AI 

Nov. 10-11, Wireless Congress 2004: Systems & Applications
Munich, Germany
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVP0AJ 

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5. Magazine Highlights
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In case you missed them, here are some of the high points of our most 
recent issue.

October 18, 2004:

* Cover Story: Engineering Feature -- The Ballot Is Open On Electronic 
Voting
E-voting will play a key role in the upcoming U.S. national election, 
despite ongoing charges that electronic voting machines are rife with 
security flaws and may be susceptible to EMI.
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVQ0AK

* Technology Report -- Evolving PoE Promises Rich Landscape Of Power 
Innovation
Developments surrounding Power over Ethernet include a number of 
unexpected apps, many spec-compliant products from chips to midspan 
hubs, and efforts to boost the maximum current that's deliverable via 
Ethernet cable.
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVR0AL

* Technology Report -- Architectural Advances Propel FPGAs Into High-End 
ASIC Turf
Finer features and architectural enhancements let the latest-generation 
FPGAs deliver high gate counts and application-targeted resources to 
implement complex systems-on-a-chip.
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVS0AM

* Leapfrog: Industry First -- 32-Bit Architecture Challenges 8-Bit 
Processors
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVT0AN

* Leapfrog: Industry First -- Power Supply Eyes Next Generation Of 
Blades
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVU0AO

* Design View/Design Solution -- Design Great Interconnects By Treating 
FPGAs Like Software
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVV0AP

For the complete Table of Contents, go to Electronic Design ==> 
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BMVW0AQ

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mailto:[email protected]

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