For small volume production, the Fusion3D 1100 system creates three dimensional circuits and laser-structuring of molded interconnect devices. Reportedly, the system is quite compact, making it easy to install into any work environment. It employs laser direct structuring technology (LDS) and MID to combine mechanical structures and electronic circuits into one 3D part. MID consists of circuit traces embedded into molded thermoplastics which creates an electrical pathway. The 3D circuits are structured by using LDS-grade resin which is laser activated by a scanner based laser system. Next, the system writes circuit patterns onto the molded piece. Conductive paths receive plating via electro-less plating technology. LPKF LASER & ELECTRONICS AG, Wilsonville, OR. (800) 345-5753.