Electronic Design

Silver Adhesive Is USP Savvy

The EP3HTSMED epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and fully meets USP Class VI requirements for medical applications. The silver-filled epoxy adhesive/sealant offers reliable electrical conductivity with a volume resistivity less than 0.001 Ohm cm. Serviceable over a temperature range of -60°F to 400°F, EP3HTSMED resists severe thermal cycling and many chemicals including water, fuels, oil, and most organic solvents. It requires no mixing and needs only contact pressure during a simple heat cure of 20 to 40 minutes at 300°F or 40 to 90 minutes at 250°F. MASTER BOND INC., Hackensack, NJ. (201) 343-8983.

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