Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages

Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages

Sponsored by ANSYS

Learn how ANSYS simulation software can help accurately predict electromagnetic, thermal and mechanical performance of a PCB.
 
Used for all electrical CAD types including IC packages, touch panel displays and glass or silicon interposers, this design flow details every aspect of the design flow from geometry input to viewing results.
 
The ANSYS design flow yields power losses across the entire board and determines whether the integrated circuit (IC) and overall board temperatures lie within safe operating limits and predicts overall PCB reliability.

ANSYS

TAGS: EDA