Electronic Design
Envelope Tracking IC Seeks Smartphones

Envelope Tracking IC Seeks Smartphones

The first member of the Coolteq.L family of Envelope Tracking (ET) power supply modulators for mobile handsets is expected to reduce wasted energy from power amplifiers (PAs) in mobile handsets by more than 50%, cutting heat dissipation and extending battery life. Designated the NCT-L1100, the chip demonstrates power conversion efficiencies in excess of 80% and supports the maximum 20-MHz channel bandwidth of LTE. The technology has already been validated through system integration with two major platform chipset vendors. The new chip is compatible with multiple air interface standards, including TDD and FDD LTE.  The company’s ISOGAIN linearization technology delivers improved ACLR and EVM performance, eliminating antenna load mismatch and providing additional output power from the PA. The NCT-L1100 also features the industry-standard OpenET analog envelope interface, and a MIPI RFFE control interface. Production devices will be available in small footprint WLCSP packages. The company provides platform chipset vendors with evaluation boards and engineering support for integration into reference designs for smartphones and data devices. The NCT-L1100 is sampling now to lead partners with general availability in Q4 2012. NUJIRA, Cambridge, U.K.

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