AMKOR and IMEC sign 3D deal

Leuven, Belgium, and Chandler, AZ, USA: Amkor Technology, a provider of advanced semiconductor assembly and test services, and IMEC, Europe’s independent nanoelectronics and nanotechnology research centre, announced a two-year collaboration agreement to develop cost-effective, 3D integration technology. The new technology will be based on wafer-level processing techniques.

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