EE Product News

Adapter Eases Placement Of 1.00-mm Pitch BGAs On Breadboards

With these 1.00-mm BGA adapters, prototypers can easily add 1.00-mm BGAs to breadboards, thereby skirting either the complications and costs encountered in soldering the chips to the adapter s or the inductive loading problems presented when using large-sized adapters. The new adapters have the same configuration as the BGA package footprint, thereby minimizing trace lengths and adapter height. They use a zero insertion force (ZIF) socket that enables up to 10,000 test insertions. For testing purposes, the adapter is simply plugged into the prototyping board with a 0.10" center grid and the IC placed in the socket and the prototype is ready to operate. Use of the adapter as a test socket is also easy: problem BGA devices need only be removed from a production board and inserted in the adapter and the device tested outside the circuit- this is accomplished by attaching test equipment to the adapter.


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