Representing the first in a series of packaging products to be developed by the company that conform to PICMG 3.0 specs, the AdvancedTCA (ATCA) development system incorporates a full mesh 14-slot backplane in a 12U, 84HP sub-rack and is designed to dissipate up to 120W/board of heat using three cooling fans—ATCA is an open, multi-vendor architecture for achieving extremely high processor density and communications bandwidth, augmented by a robust mechanical and electrical construction. The enclosure also provides redundancy through use of dual Intel ZT 7101 shelf-management controllers and dual 48V, 60A power input filters supplying 48 Vdc of power. For more information and pricing, contact George Ross at PENTAIR ELECTRONIC PACKAGING, Scroff Products, Warwick, RI. (888) 550-9543.
Company: PENTAIR ELECTRONIC PACKAGING - Scroff Products
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