Housed in a 32 mm x 25 mm, 219-ball PBGA package, the WEDPND16M72S-XBX 128-MB double data rate (DDR) SDRAM reduces board space requirements by 40% compared to a discrete approach. It also offers a lower profile and reduces I/O connections by up to 19%, as well as reducing inductance and capacitance for low noise performance. The memory multichip module (MCM) is available in speeds of 200, 250 and 266 MHz and in 16M x 64 and 16M x 72 memory configurations. The DDR SDRAM chips employ a high-speed CMOS design that operates from a 2.5V supply. They are internally configured as a quad-bank DRAM with a synchronous interface. Available in commercial, industrial and military temperature range versions, the MCM is targeted for use in telecomm, datacomm and embedded applications. For more details, contact Jack Bogdanski at WHITE ELECTRONIC DESIGNS CORP., Phoenix, AZ. (602) 437-1520.
Company: WHITE ELECTRONIC DESIGNS CORP.
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