|Shieldless system is available with 3-mm column spacing; uses an insert-molded leadframe assembly; designers can scale systems to greater than 12 Gbits/s without a basic platform design; two-piece header-receptacle system is available in 150-position configuration for 1.0-in./25-mm slot-pitch applications||Volume pricing under $0.08 per header/receptacle pair; contact the distributor||FCI Electronics
|Standard 12-port RJ-45 connector; scales from 10/100 to 10/100/1000; includes integrated magnetics and integrated power-management silicon for embedded Power-over-Ethernet functionality; fits into the same panel dimensions as legacy 2-by-6 RJ-45 products; supports 48 ports in a standard 19-in. rack; options include single and bi-color LEDs and 10/100 and gigabit speeds||$2.50 to $6.00 per port in 1000-piece lots; 12 weeks||Tyco Electronics
|INTEGRATED CONNECTOR MODULE
|RJ-45 2-by-1 and stacked RJ-45/USB module increases port density and savings on pc-board space over 1-by-2 configurations; supports a local-area-network interface suitable for 10/100/1000-BaseTX applications; complies with IEEE 802.3i/u/ab and ANSI X3.263 standards; operates from O°C to 70°C||Start at $7.12 in 10,000-unit lots; six weeks||Pulse Engineering
|The Small Interface Cable Adapter (SICA) reduces JTAG connector footprints by 5/6; uses a surface-mount connector set with a 0.5-mm pitch on the target side; adapter line is rated to 500 insertions/extractions; kit comes with flex cable assembly and one male connector; available in 10-, 14-, 16-, and 20-pin configurations||$99.00 in single quantities; available now||Adapters.com
HiLo Flexible Interconnect System
|Allows the reuse of expensive FPGAs, reducing development costs; consists of a pin field and a low-insertion-force socket; standard products range from 100- to 1074-ball packages; compatible with standard ball-grid-array pc-board land patterns; has a minimal x-y keep-out zone||Up to $0.02 per position for production lots; small quantities available from stock||Interconnect Systems Inc.
|SOCKET AND ADAPTER SYSTEM
|Ball-grid-array (BGA) socket (S582-) and adapter (S540-) systems available in 0.8- and 1-mm and 0.05-in. sizes; can be used for socketing BGA devices and interconnecting circuit boards; socket is reflow-soldered to the same footprint as the device using solder paste; the balled device is soldered to a BGA adapter with flux or paste||$12.508 (S582-) and $12.245 (S540-) each in 100-unit lots; four weeks||Mill-Max Manufacturing Corp.
CSP/MicroBGA Test & Burn-In Socket
|Accommodates device packages up to 55 mm2 in applications up to 1 GHz; feaures a standard molded socket format; suits test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and flash devices with 0.50-mm pitches or larger; 1.92-mm signal path during test; operates from 55°C to 150°C; 500,000-cycle contact life; molded components are UL94V-0 PEEK and/or UItem||500-lead socket starts at $1174.50 in 10-unit lots; six weeks||Aries Electonics Inc.
|Enables the use of ball-grid-array (BGA) ICs with 3528 positions (total pin count) and 1-mm pitch; back-to-back assembly; high-performance conductive elastomer connector supports high-pin-count BGA devices; 10-mO contact resistance (normal); aluminum construction in socket body and heatsink screw facilitates heatsinking||$1990 in one- to four-unit lots; available immediately||Ironwood Electronics