A new line of nano-miniature interconnects has been developed for use where reliability must be maintained in critical environments and where extremely small size and light weight are required. The N-series connectors offer flexibility in terms of size, termination configuration, hardware, and shell plating options. The high-density, dual-row connectors have ruggedized, polarized metal shells for board-to-cable, cable-to-cable, and board-to-board applications. The interconnects feature 0.635 mm pitch contacts side-by-side and 0.318 mm offset row-to-row, helping qualify the connectors for use in high density packaging applications. The connectors also come in horizontal or vertical configurations with pins or sockets in 10 sizes packed with 9 to 85 contacts. Both SMT and PTH configurations incorporate shell recess areas for solder washout and inspection. The connectors are well-suited for rugged or harsh environments with conditions of extreme high or low temperatures, high vibration and shock. AIRBORN, Addison, TX. (214) 931-3200.
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