EE Product News

DIP Adapter Modules Eliminate Redesigns

The need to redesign motherboards is said to be eliminated with the introduction of a series of adapter modules that convert SOJ, TSOP, PLCC, and SOIC to DIP packages for creating drop-in replacements for end-of-life DIP ICs. The modules feature 8 to 32 pins for converting an IC that is packaged in a surface-mount SOJ, TSOP, PLCC or SOIC package to a pin-compatible direct drop-in replacement for end-of-life DIP ICs. The devices include an on-board decoupling capacitor.


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