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Interposers Adapt Pb-Free BGAs To Tin/Lead Reflow Profiles

The company's BGA Interposers promise to be a cost-effective method for converting lead-free BGA packages for use on boards processed with lower temperature, tin/lead solder profiles. Designed for RoHS-exempt applications, the components solve BGA device transition, obsolescence, and solderability issues related to the higher temperature requirements to process lead-free packages. A lead-free BGA device attaches to an interposer adapter board in a high temperature reflow process, followed by mounting eutectic solder balls on the bottom of the interposer. Device-specific interposers match the device footprint and are currently available in pitches of 0.8 mm, 1 mm, and 1.27 mm. Pricing varies by pin count and quantity. ADVANCED INTERCONNECTIONS CORP., West Warwick, RI. (800) 424-9850.


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