EE Product News

LCD Assembly Gains 2X-Production Throughput Increase

Designed for LCD module assembly, the model 4200 Series Hot Bar bonders provide the superior control necessary for joining TAB, flex or heat seal connectors to pc boards using ACF or solder reflow. The Series has dual bonding/loading stages, rotary or shuttle base, and precision process control software. The Hot Bar bonders have dual heads each with their own power control circuit. These dual head configurations are available with rotary tables or dual shuttle systems and employ parallel processing for a 2X-production throughput increase over traditional single head units.
Hot Bar bonders may be used for applications with multiple bond sites. They distribute temperature evenly across the bars while maintaining shape and lead force during bonding. Each meets J-STD-001C voltage requirements with no damaging voltage on sensitive parts.


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