EE Product News

LGA Socket Enables Solderless Chip-To-Board And Board-To-Board Connection

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Solderless chip-to-board and board-to-board interconnection can be achieved with the new cLGA socket systems. The system allows the user to avoid the termination and reliability problems caused by thermal expansion in high pin count devices. It is designed using conventional contact and housing materials. The low-profile connector design yields a .20 nH mutual inductance. The product is available in 5 x 5 through 5 x 20 configurations.

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