EE Product News

Multi-Chip SDRAM Comliments PowerPC, Saves Board Space

The WEDPN8M72V-XBX 8M x 72 SDRAM multi-chip package is claimed to compliment the PowerPC and other high-performance multiprocessors while saving up to 40% more board space than comparative solutions. The device measures 25 mm x 32 mm packaged in a 219 plastic ball grid array configuration and is said to also reduce I/O connections by 19%, providing lower inductance and capacitance.
The device operates on 3.3V and is available in speeds of 125 MHz and 100 MHz. Pricing starts at under $400 each/ 1000 and delivery is from six to eight weeks ARO.


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