Reportedly ideal for high shock and vibration applications, the company’s one-piece interfaces sport a robust design with threaded inserts for board mounting. They also promise low-cost board stacking by reducing the number of necessary components and improve quality over elastomeric systems and pin-and-socket systems. The FSI Series dual-row interfaces on a 1-mm pitch provides a range of board spacings from 3 mm to 10 mm between boards. For lower-profile applications on a 1 mm pitch, the SEL Series provides 0.64-mm and 1.27-mm board spacings while the SEI Series provides 1.65 mm spacing. The GFZ Series high-density array interconnects provide up to 1,200 I/Os and a 3-mm board-spacing profile. In addition, the SIB Series one-piece interfaces and the single- and double-row one-piece pogo-style PGP Series target specialty applications on a 2.54-mm pitch. Pricing begins at about $0.05 per pin in small production quantities. SAMTEC INC., New Albany, IN. (800) 726-8329.
Company: SAMTEC INC.
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